ConferenceEngineeringMechanical Engineering

International Conference on Thermal Systems and Mechanical Engineering Innovations

ICTSMEI

Thu, May 21, 2026
Geneva, Switzerland
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers

Thermal systems
heat transfer analysis
thermodynamics applications
thermal energy storage
thermal system design
computational heat transfer
thermal efficiency optimization
cooling systems
waste heat recovery
advanced thermal materials
thermal management in engineering
renewable thermal systems
cryogenics
thermal fluid systems
sustainable thermal innovations
applied thermal engineering

Important Dates

Start Date

Thursday, May 21, 2026

Registration Deadline

Wednesday, May 6, 2026

Submission Deadline

Friday, May 1, 2026

Venue
Geneva, Geneve, Switzerland

Geneva, Geneve, Switzerland

Deadline: May 1, 2026

Official Website
Organizer

Science Cite

Akash Shinde
Quick Info
TypeConference
MonthMay-2026
    International Conference on Thermal Systems and Mechanical Engineering Innovations | International Conference Alerts | International Conference Alerts