ConferenceEngineeringHeat Transfer

International Conference on Thermal Management in Electronics and Microdevices

ICTMEM

Fri, Jul 10, 2026
Hawaii, United States
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers

thermal management
electronics
microdevices
heat dissipation
thermal engineering
computational modeling
system optimization
energy efficiency
heat sinks
thermal analysis
microelectronics
energy systems
convective heat transfer
thermal systems
electronic cooling

Important Dates

Start Date

Friday, July 10, 2026

Registration Deadline

Thursday, June 25, 2026

Submission Deadline

Saturday, June 20, 2026

Venue
Hawaii, Hawaii, United States

Hawaii, United States

Deadline: Jun 20, 2026

Official Website
Organizer

APSTE

Sanjay DSouza(Abroad)
Quick Info
TypeConference
MonthJuly-2026