ConferenceEngineeringHeat Transfer

International Conference on Thermal Conductivity and Material Engineering

ICTCME

Tue, Jun 30, 2026
Yokohama, Japan
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers

thermal conductivity
material engineering
heat transfer properties
thermal analysis
energy systems
material science
conduction
thermal management
computational modeling
system optimization
nanomaterials
thermal design
process engineering
energy efficiency
thermal systems

Important Dates

Start Date

Tuesday, June 30, 2026

Registration Deadline

Monday, June 15, 2026

Submission Deadline

Wednesday, June 10, 2026

Venue
Yokohama, Tokyo, Japan

Yokohama, Tokyo, Japan

Deadline: Jun 10, 2026

Official Website
Organizer

Scholars Forum

Alan James
Quick Info
TypeConference
CountryJapan
MonthJune-2026