ConferenceEngineeringThermal Engineering
International Conference on Thermal Comfort and Engineering Design
ICTCED
Thu, May 14, 2026
Singapore, Singapore
ConferenceEngineeringThermal Engineering
International Conference on Thermal Comfort and Engineering Design
ICTCED
Thu, May 14, 2026
Singapore, Singapore
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers
Thermal comfort
indoor environment
HVAC design
human-centric thermal design
temperature regulation
ergonomic thermal conditions
building thermal performance
airflow design
thermal zoning
climate control
environmental comfort assessment
energy-efficient thermal design
occupant comfort modeling
advanced thermal comfort solutions
thermal environment optimization
sustainable building thermal design
Important Dates
Start Date
Thursday, May 14, 2026
Registration Deadline
Wednesday, April 29, 2026
Submission Deadline
Friday, April 24, 2026
Venue
Singapore, Singapore, Singapore
Singapore