ConferenceEngineeringMaterials Engineering

International Conference on Electronic Materials and Materials Engineering Applications

ICEMMEA

Mon, Apr 13, 2026
Washington DC, United States
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers

Electronic materials
semiconductor materials
optoelectronic materials
dielectric materials
ferroelectric materials
conductive polymers
photovoltaic materials
electronic ceramics
magnetic semiconductors
electronic thin films
electronic device materials
nanoelectronic materials
flexible electronic materials
microelectronic packaging materials
electronic innovations in materials engineering

Important Dates

Start Date

Monday, April 13, 2026

Registration Deadline

Sunday, March 29, 2026

Submission Deadline

Sunday, March 29, 2026

Venue
Washington DC, Washington, United States

Washington DC, Washington, United States

Deadline was Mar 29, 2026

Official Website
Organizer

Scholars Forum

Alan James
Quick Info
TypeConference
MonthApril-2026