ConferenceEngineeringMaterials Engineering
International Conference on Electronic Materials and Materials Engineering Applications
ICEMMEA
Tue, May 19, 2026
Kuala Lumpur, Malaysia
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
ConferenceEngineeringMaterials Engineering
International Conference on Electronic Materials and Materials Engineering Applications
ICEMMEA
Tue, May 19, 2026
Kuala Lumpur, Malaysia
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers
Electronic materials
semiconductor materials
optoelectronic materials
dielectric materials
ferroelectric materials
conductive polymers
photovoltaic materials
electronic ceramics
magnetic semiconductors
electronic thin films
electronic device materials
nanoelectronic materials
flexible electronic materials
microelectronic packaging materials
electronic innovations in materials engineering
Important Dates
Start Date
Tuesday, May 19, 2026
Registration Deadline
Monday, May 4, 2026
Submission Deadline
Wednesday, April 29, 2026
Venue