ConferenceEngineeringMaterials Engineering

International Conference on Electronic Materials and Materials Engineering Applications

ICEMMEA

Tue, May 19, 2026
Harare, Zimbabwe
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers

Electronic materials
semiconductor materials
optoelectronic materials
dielectric materials
ferroelectric materials
conductive polymers
photovoltaic materials
electronic ceramics
magnetic semiconductors
electronic thin films
electronic device materials
nanoelectronic materials
flexible electronic materials
microelectronic packaging materials
electronic innovations in materials engineering

Important Dates

Start Date

Tuesday, May 19, 2026

Registration Deadline

Monday, May 4, 2026

Submission Deadline

Wednesday, April 29, 2026

Venue
Harare, Harare, Zimbabwe

Harare, Zimbabwe

Deadline: Apr 29, 2026

Official Website
Organizer
Quick Info
TypeConference
CountryZimbabwe
MonthMay-2026