ConferenceEngineeringElectrical and Electron...
International Conference on Electronics Packaging and Assembly Engineering
IC-EPAE
Tue, Aug 18, 2026
Bat Yam, Israel
ConferenceEngineeringElectrical and Electron...
International Conference on Electronics Packaging and Assembly Engineering
IC-EPAE
Tue, Aug 18, 2026
Bat Yam, Israel
About This Conference
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Call for Papers
electronics packaging
assembly engineering
PCB design
microelectronics
VLSI
embedded systems
electronics engineering
signal processing
control systems
power electronics
thermal management
computational modeling
energy efficiency
testing and verification
system reliability
hardware optimization
device fabrication
energy materials
performance analysis
energy management
Important Dates
Start Date
Tuesday, August 18, 2026
Registration Deadline
Monday, August 3, 2026
Submission Deadline
Wednesday, July 29, 2026
Venue
Bat Yam, Bat Yam, Israel
Bat Yam, Israel